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HIGH TECH CHIPS, INC. Melody Generator 1.0 General description. This circuit is designed to work as melody generator. HTC750 will play selected melody (selection is done by driving D0 and D1 inputs to low or high value) and once melody is finished it will enter power saving mode which we call Sleep mode. In Sleep mode HTC750 consumes less then few microamps of current. One of possible uses of HTC750 is designing it in doorbell. This device was designed using our proprietary melody storing scheme to optimize PDIP, SOIC internal memory usage. HTC750 can play up to four melodies. It can directly drive piezo-electrical sound source or with use of VDD GND 1 8 external amplifier can drive speakers. Control output is NU MOUT 2 7 NU CNTL provided to control external relay or power switch. This output 3 6 D1 D0 4 5 goes high for duration of melody and could be used to control the power to HTC750 and amplifier for duration of melody.
HTC750XXX
Possible uses are: * Musical doorbell. * Melody generator for alarm clock. * Musical toys. * Musical boxes for gifts, accessories or jewelry. Features: * Single chip solution. * Minimum external components. * Four selectable melodies. * Minimum power consumption while in SLEEP mode. Doorbell design using HTC750
S1 C1 R1 R2 100K 2 3 1 2 4 3 4 5 NU NU D1 D0 HTC750 1K Q2 PNP U1 VDD MOUT CNTL GND 0.1uF 1 7 6 8 R3 C3 47uF LS1 4.5V
100K
Q1 NPN
BT1
8ohm
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HIGH TECH CHIPS, INC. 2.0 Functional Description. We will use schematics above to describe HTC750 operation. At power up HTC750 plays melody set by dip-switch. After finishing melody it goes into sleep mode and drives all outputs to GND. In prototypes we build using above schematics current consumption was less then 10uA. This current is negligible enough to leave circuit constantly powered on. When device is in Sleep mode only way of waking up the circuit is to recycle power. This is done using S1 pushbutton. Note that we are using pushbutton with normal closed contacts. When this pushbutton is activated power to HTC750 is cut down and when this pushbutton is released then part will play the melody. One can use pushbutton with normal open contacts but it could result partial reproduction of melody. Note the way CNTL output is used to save energy during Sleep mode. Energy saving is achieved by cutting power to R1 and R2 resistors when part enters into Sleep mode and preventing battery discharge through those resistors when associated dip-switch is on. T1 and T2 form simple current amplifier to drive 8-ohm speaker. Almost any small signal transistor could be used in this amplifier. Note that this amplifier will introduce additional distortions to amplified signal, because transistors are not biased. This is done intentionally to simplify amplifier circuit and add one distinct character. This amplifier does not use any current when its input is driven low. Any other amplifier circuit could be used as long as care is taken to shut down the amplifier with CNTL output of HTC750 to save buttery. This could be done by external relay. Quality of sound could be further enhanced if low pass filter is added to output of HTC750. Please see Application note for HTC750. Pin out description.
Abbreviations used: O - output, I - input, P - power.
Pin 1 2 3 4 5 6 7 8 Name VDD NU NU D1 D0 CNTL MOUT GND I/O P I I I I O O P Description Power Not Used Not Used Melody selection input. Melody selection input. Control output Melody output Ground Notes +2.5V to +5.5V Tie it to GND or VDD. Tie it to GND or VDD. Tie it to GND or VDD. Tie it to GND or VDD. This output is driven high when part plays melody. Can deliver up to 25mA current. Signal on this output is square wave. Connect to ground.
3.0 Melody selection with D[0:1] D1 GND GND VDD VDD 04/30/00 D0 GND VDD GND GND MELODY Number 1 Number 2 Number 3 Number 4 2
HIGH TECH CHIPS, INC. This table shows melody played when D0 and D1 are tied to ground or power. Note that this part comes with different sets of melodies and those melody samples will be made available for download.
4.0 Electrical characteristics. Voltage on VDD pin in respect to GND Operational current with no external load Current used in SLEEP mode MOUT output low voltage max (5mA load) MOUT output high voltage min (5mA source) MOUT maximum sink current MOUT maximum source current CNTL output low voltage max (5mA load) CNTL output high voltage min (5mA source) CNTL maximum sink current CNTL maximum source current NOTES: 1. Those values are characterized but not tested. 5.0 Ordering information.
H T C 7 5 0 X X X OPTIONAL: Temperature range: C = 0oC to +70oC , I = - 40oC to + 85oC. PACKAGE: S - 208 mil SOIC D - 300 mil PDIP. MELODY PART NUMBER.
+2.5 to +5.5V 3 mA1 4uA1 0.4V1 VDD-0.7V1 25mA1 25mA1 0.4V1 VDD-0.7V1 25mA1 25mA1
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HIGH TECH CHIPS, INC. 6.0 Mechanical information.
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
Units INCHES* Dimension Limits MIN NOM Number of Pins n 8 Pitch p .100 Top to Seating Plane A .140 .155 Molded Package Thickness A2 .115 .130 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 Molded Package Width E1 .240 .250 Overall Length D .360 .373 Tip to Seating Plane L .125 .130 Lead Thickness c .008 .012 Upper Lead Width B1 .045 .058 Lower Lead Width B .014 .018 Overall Row Spacing eB .310 .370 Mold Draft Angle Top 5 10 Mold Draft Angle Bottom 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold not exceed .010" (0.254mm)per side. JEDEC Equivalent:MS-001
MAX
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS MIN NOM MAX 8 2.54 3.56 3.94 4.32 2.92 3.30 3.68 0.38 7.62 7.94 8.26 6.10 6.35 6.60 9.14 9.46 9.78 3.18 3.30 3.43 0.20 0.29 0.38 1.14 1.46 1.78 0.36 0.46 0.56 7.87 9.40 10.92 5 10 15 5 10 15
flash protrusions. Mold flash or protrusions shell
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HIGH TECH CHIPS, INC.
8-Lead Plastic Small Outline (SM) - Medium, 208 mil (SOIC)
Units INCHES* MILLIMETERS Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins n 8 8 Pitch P .050 1.27 Overall Height A .070 .075 .080 1.78 1.97 2.03 Molded Package Thickness A2 .069 .074 .078 1.75 1.88 1.98 Standoff A1 .002 .005 .010 0.05 0.13 0.25 Overall Width E .300 .313 .325 7.62 7.95 8.26 Molded Package Width E1 .201 .208 .212 5.11 5.28 5.38 Overall Length D .202 .205 .210 5.13 5.21 5.33 Foot Length L .020 .025 .030 0.51 0.64 0.76 Foot Angle 0 4 8 0 4 8 Lead Thickness c .008 .009 .010 0.20 0.23 0.25 Lead Width B .014 .017 .020 0.36 0.43 0.51 Mold Draft Angle Top 0 12 15 0 12 15 Mold Draft Angle Bottom 0 12 15 0 12 15 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash protrusions. Mold flash or protrusions shell not exceed .010" (0.254mm)per side.
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HIGH TECH CHIPS, INC. HTC makes no warranty, express, statutory implied or by description, regarding information set forth herein or regarding the freedom of described devices from patent infringement. HTC makes no warranty or merchantability or fitness for any purposes. HTC reserves right to discontinue production and change specifications and prices at any time and without notice. HTC's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by HTC for such applications. High Tech Chips, Inc. www.hightechips.com info@hightechips.com
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